MICROELECTRONICS II

Scaling rules for unipolar and bipolar transistors. Monolithic IC’s based on GaAs and heterostructures (MESFET, HEMT, HBT). Hybrid IC’s. Thin film devices. Digital IC’s. Basic monolithic gate circuits (design, fabrication, characteristics, optimization, topologies). Analog monolithic IC’s (design, fabrication, characteristics). Power transistors in monolithic IC’s. Monolithic multilayer devices. Power dissipation and heat transfer. Principles of electronic packaging. Internal interconnections and contact pads. Surface acoustic wave (SAW) devices (operation, types, characteristics and application). CCD devices.